P-17 Stylus Profiler0 pages
Production Series
METROLOGY
P-17 Stylus Profiler
The P-17 is the 8th generation of the P-series stylus profiler, building on over 35 years
of profilometry expertise. The system offers a programmable scan stage, low noise,
and high-quality, high-resolution long scans enabling measurement of a variety of
surfaces and applications.
The P-17 offers industry leading measurement repeatability for reliable measurement
performance. The system has 200 mm scan length standard — the only stylus profiler
on the market to offer long scan capability without the need for stitching. The UltraLite®
sensor includes dynamic force control, excellent linearity, and the highest vertical
resolution making it the best sensor available on a stylus profiler. The P-17 includes
many features to enhance the user experience such as top and side view optics, and
motorized theta/leveling stages. Finally, the system includes point-and-click operation
and the productvity package to offer the easiest to use tool on the market with the
features required by university, R&D, and production environments.
The P-17 OF (open frame) includes all of the capability of the P-17, but allows the user
to load larger samples on the 9.5 by 9.5-inch square stage or 300 mm sample chuck.
High Resolution 3D Scanning Capability
Thin Film Step Height Measurement Capability
APPLICATIONS
Semiconductors
CMP dishing, pattern-dependent erosion, surface topography characterization, and oxide planarity for
greater device performance and yield loss reduction. Measures height, co-planarity and roughness of
bumps for flip chip technology. Performs etch depth monitoring on open geometries with automated
analysis and simple process set-ups.
Data Storage
Thin film head wafers and sliders, hard disks, optical and magnetic media. Wafer applications include
plating thickness, coil heights, and CMP planarity. Slider applications include pole-tip recession analysis,
air bearing cavities, and laser texture bump characterization that includes bump height, width, and
depth analysis.
MEMS and Opto-Electronics
MEMS and opto-electronics step heights, micro-lens height and curvature, and DWDM etch depths.
Other Applications
Hybrid circuits and ceramic substrates, paper and foil finishes, polished and machined surfaces, coated
or painted surfaces, and precision-machined surfaces of any kind.
3D Stress = Full Surface Stress Control
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