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CP7300
TM
Z Y G O C O R P O R AT I O N ’ S
CP7300™
Wafer Metrology
System
— Fast accurate, repeatable 3D areal
surface mapping – in just seconds!
— Noncontact measurements – under
ambient conditions!
— Patented, proprietary vertical scanning
technology provides superior vertical
resolution (~0.1 nm) – in a single
measurement!
— Large, dynamic vertical (Z) scan range
– from 0.1 nm to 20 mm!
— 0.5X – 200X magnification range –
to meet all your lateral resolution and
field size needs!
— Automated sample measurement and
positioning capabilities – for increased
ease-of-use!
— Standard and custom solutions and
configurations available – to meet your
application requirements!
Many semiconductor manufacturing processes, including chemical mechanical polishing (CMP), require critical control
and monitoring of surface metrology parameters. Rapid insight into process variations are key to increasing yields by
enabling faster refinements and corrections to manufacturing processes.
Today’s continuous drive toward reductions in feature size and increasing demands on device specifications are pushing
the requirements for value-added process monitoring and metrology. The CP7300 allows semiconductor manufacturers
faster process development, parametric control and optimization of the chemical mechanical polishing (CMP) and wafer
thinning process by providing precise, nanometer-scale surface height and wafer topography measurements.
Employing proprietary optical scanning technology, the CP7300 provides fast, noncontact, automated 3D surface height,
roughness, and local area planarity and uniformity measurements on wafers for rapid, quantitative characterization of
photo-lithographic, etch, and polishing process effects. Surface metrology applications include, but are not limited to,
measurement and process control of critical surface texture parameters on bare and patterned wafers.
Programmable and automated measurement sequences and sample positioning allows for surface characterization at
multiple sites and locations. Integral to each system is a comprehensive and powerful software analysis package with
application-specific modules, providing full 3D imaging and data reporting of many surface topography parameters.
